US Patent Issued to Taiwan Semiconductor Manufacturing on April 8 for "Semiconductor packages having conductive pillars with inclined surfaces" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,664, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages having conductive pillars with inclined surfaces" was invented by Chiang-Jui Chu (Yilan County, Taiwan), Ching-Wen Hsiao (Hsinchu, Taiwan), Hao-Chun Liu (Hsinchu, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Young-Hwa Wu (Tainan, Taiwan) and Tao-Sheng Chang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greate...