US Patent Issued to Taiwan Semiconductor Manufacturing on April 8 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,568, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Jiun-Ting Chen (Hsinchu, Taiwan), Chih-Wei Wu (Yilan County, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan), Ting-Yu Yeh (Hsinchu, Taiwan) and Chen-Hsuan Tsai (Taitung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer a...