US Patent Issued to Taiwan Semiconductor Manufacturing on April 8 for "Package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,622, issued on April 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and manufacturing method thereof" was invented by Ming-Fa Chen (Taichung, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Jian-Wei Hong (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a semiconductor carrier, a first die, a second die, a redistribution structure, and an electron transmission path. The first die is disposed over the semiconductor carrier. The second die is stacked on the first die. The redistribution structure is over the second die. The electron transmission path extends from the semiconducto...