US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 8 for "Method of manufacturing a semiconductor device and a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,603, issued on April 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device and a semiconductor device" was invented by Hung-Li Chiang (Taipei, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Tzu-Chiang Chen (Hsinchu, Taiwan), I-Sheng Chen (Taipei, Taiwan) and Lei-Chun Chou (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a plurality of fin structures extending in a first direction over a semiconductor substrate. Each fin structure includes a first region proximate to the semiconductor substrate a...