US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 8 for "Method of manufacturing a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,554, issued on April 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing a semiconductor device" was invented by Jia-Lin Wei (Hsinchu, Taiwan), Ming-Hui Weng (Hsinchu, Taiwan), Chih-Cheng Liu (Hsinchu, Taiwan), Yi-Chen Kuo (Hsinchu, Taiwan), Yen-Yu Chen (Hsinchu, Taiwan), Yahru Cheng (Hsinchu, Taiwan), Jr-Hung Li (Hsinchu, Taiwan), Ching-Yu Chang (Hsinchu, Taiwan), Tze-Liang Lee (Hsinchu, Taiwan) and Chi-Ming Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal...