US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 8 for "Method and system for wafer-level testing" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,270,852, issued on April 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and system for wafer-level testing" was invented by Jun He (Hsinchu, Taiwan), Yu-Ting Lin (Hsin-Chu, Taiwan), Wei-Hsun Lin (Hsinchu County, Taiwan), Yung-Liang Kuo (Hsinchu, Taiwan) and Yinlung Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method and a system for testing semiconductor device. The method includes the following operations: energizing an integrated circuit (IC) on a wafer by raising a voltage of the IC to a first voltage level during a first period, and applying to the...