US Patent Issued to Taiwan Semiconductor Manufacturing on April 29 for "Structures and methods for processing a semiconductor substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,706, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structures and methods for processing a semiconductor substrate" was invented by Ming-Yi Shen (Hsinchu, Taiwan), Hsin-Lin Wu (Hsinchu, Taiwan), Yao-Fong Dai (Hsinchu, Taiwan), Pei-Yuan Tai (Hsinchu, Taiwan), Chin-Wei Chen (Hsinchu, Taiwan), Yin-Tun Chou (Hsinchu, Taiwan), Yuan-Hsin Chi (Hsinchu, Taiwan) and Sheng-Yuan Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chambe...