US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 29 for "Semiconductor structures having wells with protruding sections for pickup cells" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,784, issued on April 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Semiconductor structures having wells with protruding sections for pickup cells" was invented by Yung Feng Chang (Hsinchu, Taiwan), Chun-Chia Hsu (Hsinchu, Taiwan), Tung-Heng Hsieh (Hsinchu County, Taiwan) and Bao-Ru Young (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate having a first well of a first conductivity type and a second well of a second conductivity type. From a top view, the first well includes first and seconds edges extending along a first direction. The second edg...