ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,752, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Ming-Fa Chen (Taichung, Taiwan), Nien-Fang Wu (Chiayi, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Tzuan-Horng Liu (Taoyuan, Taiwan) and Chao-Wen Shih (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed la...