ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,790, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and method" was invented by Shahaji B. More (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment device includes: an isolation region on a substrate; a first fin extending above a top surface of the isolation region; a gate structure on the first fin; and an epitaxial source/drain region adjacent the gate structure, the epitaxial source/drain region having a first main portion and a first projecting portion, the first main portion disposed in the first fin, the first projecting portion disposed on a fi...