US Patent Issued to Taiwan Semiconductor Manufacturing on April 29 for "Semiconductor device, semiconductor package, and methods of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,730, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device, semiconductor package, and methods of manufacturing the same" was invented by Chang-Jung Hsueh (Taipei, Taiwan), Cheng-Nan Lin (Hsinchu, Taiwan), Wan-Yu Chiang (Hsinchu, Taiwan), Wei-Hung Lin (Hsinchu County, Taiwan), Ching-Wen Hsiao (Hsinchu, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second si...