US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 29 for "Reduce mask defect impact by contamination decompose" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,287,590, issued on April 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Reduce mask defect impact by contamination decompose" was invented by Chi-Hung Liao (Sanchong, Taiwan) and Po-Ming Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprises cleaning a surface of a reticle by irradiating the surface of the reticle in a first exposure device for a predetermined irradiation time. A layout pattern of the reticle is projected onto a photo resist layer of a wafer in a second exposure device by an EUV radiation. The photo resist layer is developed to generate a photo resist pattern on th...