US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 29 for "Layout designs of integrated circuits having backside routing tracks" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,785, issued on April 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Layout designs of integrated circuits having backside routing tracks" was invented by Wei-An Lai (Hsinchu, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit includes a horizontal routing track in a first metal layer, and a backside routing track in a backside metal layer. The backside metal layer and the first metal layer are formed at opposite sides of a semiconductor substrate. The horizontal routing track is con...