US Patent Issued to Taiwan Semiconductor Manufacturing on April 29 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,729, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Tzu-Sung Huang (Tainan, Taiwan), Ming Hung Tseng (Toufen Township, Taiwan), Yen-Liang Lin (Taichung, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chi-Ming Tsai (New Taipei, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Chih-Wei Lin (Zhubei, Taiwan) and Ming-Che Ho (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having ...