US Patent Issued to Taiwan Semiconductor Manufacturing on April 29 for "Deposition system for high accuracy patterning" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,979, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Deposition system for high accuracy patterning" was invented by Ping-Yin Liu (Yonghe, Taiwan), Chia-Shiung Tsai (Hsin-Chu, Taiwan), Xin-Hua Huang (Xihu Township, Taiwan), Yu-Hsing Chang (Taipei, Taiwan) and Yeong-Jyh Lin (Caotun Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a processing tool that includes a first wafer-mounting frame and a second wafer-mounting frame. The first wafer-mounting frame is configured to retain a target wafer. The second wafer-mounting frame is configured to retain a m...