US Patent Issued to Taiwan Semiconductor Manufacturing on April 29 for "Conductive structure connection with interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,290,003, issued on April 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Conductive structure connection with interconnect structure" was invented by Sheng-Chau Chen (Tainan, Taiwan), Cheng-Tai Hsiao (Tainan, Taiwan), Cheng-Yuan Tsai (Chu-Pei, Taiwan) and Hsun-Chung Kuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to a semiconductor structure. The semiconductor structure includes a conductive structure over a semiconductor substrate. A first dielectric layer is over the conductive structure. A second dielectric layer is over the first dielectric layer. An interconnect struct...