US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 29 for "Backside illuminated image sensor device with shielding layer and forming method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,798, issued on April 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Backside illuminated image sensor device with shielding layer and forming method" was invented by Volume Chien (Tainan, Taiwan), Su-Hua Chang (Chiayi County, Taiwan), Chia-Yu Wei (Tainan, Taiwan), Zen-Fong Huang (Tainan, Taiwan) and Chi-Cherng Jeng (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor includes a pixel array, a dielectric layer, a plurality of first conductive shielding regions, and a plurality of second conductive shielding regions. The pixel array includes photodiodes within a substrate. The dielectric la...