ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,568, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Wafer bonding alignment" was invented by Hsi-Cheng Hsu (Taichung, Taiwan), Jui-Chun Weng (Taipei, Taiwan), Ching-Hsiang Hu (Taipei, Taiwan), Ji-Hong Chiang (Changhua, Taiwan), Kuo-Hao Lee (Hsinchu, Taiwan), Chia-Yu Lin (Taoyuan, Taiwan), Chia-Chun Hung (Chiayi, Taiwan), Yen-Chieh Tu (Taichung, Taiwan), Chien-Tai Su (Hsinchu, Taiwan) and Hsin-Yu Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, wher...