US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Silver patterning and interconnect processes" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,255, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Silver patterning and interconnect processes" was invented by You-Hua Chou (Hsinchu, Taiwan) and Kuosheng Chuang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure is provided. The method includes depositing a hard mask layer over a substrate. The method further includes depositing a silver precursor layer over the hard mask layer. The method further includes exposing portions of the silver precursor layer to a radiation, the radiation causing a reduction of silver ions in the irradiated ...