US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Semiconductor structure and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,532, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacture" was invented by Yao-Te Huang (Hsinchu, Taiwan) and Liang-Chor Chung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Test pad structures and methods of forming a test pad are described herein. A method for forming a test pad includes forming a device element over a substrate, depositing a dielectric layer over the device element and the substrate, and etching openings in the dielectric layer to a first depth. Once the openings have been formed, a conductive material is deposited in ...