US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,564, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Min-Feng Kao (Chiayi, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Hsing-Chih Lin (Tainan, Taiwan) and Zheng-Xun Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes top, bottom, and middle tiers. The bottom tier includes a first interconnect structure overlying a first semiconductor substrate, and a first front-side bondin...