US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Semiconductor structure and manufacturing method of the same" (Taiwanese, Singaporean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,814, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method of the same" was invented by Harry-Hak-Lay Chuang (Paya Lebar Crescent, Singapore), Sheng-Huang Huang (Hsinchu, Taiwan), Keng-Ming Kuo (Yunlin County, Taiwan) and Hung Cho Wang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure, including a memory region, a logic region adjacent to the memory region, a first magnetic tunneling junction (MTJ) cell and a second MTJ cell over the memory region, and a carbon-based layer over the m...