US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Semiconductor processing method and apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,512, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor processing method and apparatus" was invented by Shuang-Shiuan Deng (Hsinchu, Taiwan), Fan-Chi Lin (Hsinchu, Taiwan), Chueh-Chi Kuo (Hsinchu, Taiwan), Li-Jui Chen (Hsinchu, Taiwan) and Heng-Hsin Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: positioning a wafer on an electrostatic chuck of an apparatus; and securing the wafer to the electrostatic chuck by: securing a first wafer region of the wafer to a first chuck region of the electrostatic chuck by applying a first voltage at a first time. T...