US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Semiconductor die with warpage release layer structure in package and fabricating method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,553, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor die with warpage release layer structure in package and fabricating method thereof" was invented by Chin-Hua Wang (New Taipei, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Tsung-Yen Lee (Changhua County, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a first semiconductor die bonded over an interposer substrate and a warpage release layer structu...