US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Semiconductor device including cumulative sealing structures" (Taiwanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,589, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including cumulative sealing structures" was invented by Liang-Chen Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a core region of core circuitry over a substrate; an input/output (I/O) region of interfacing circuitry over a substrate and coupled to the core region; a sealing ring having first, second and third sides, the sealing ring surrounding, and being isolated from, the core region and the I/O region; an intra-communication (intra-com) stack including intra-com s...