ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,570, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Ming-Fa Chen (Taichung, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first die, a dielectric layer, a second interconnection structure, a second conductive pad and a conductive feature. The first die includes a first interconnection structure over a first substrate and a first conductive pad disposed on and electrically connected to the first interconnection structure. The first conductive pad has a ...