ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,556, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a die, an encapsulant and a RDL structure. The RDL structure is disposed on the die and the encapsulant. The RDL structure includes a first dielectric structure and a first redistribution layer. The first dielectric structure includes a first dielectric material layer and a second dielectric material la...