US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Methods related to forming semiconductor devices" (Taiwanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,588, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods related to forming semiconductor devices" was invented by Jack Liu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: providing a cell of a first group that supplies a first potential from a backside of a substrate, multiple cells of a second group, and two cells of a third group that supply a second potential from the backside; determining a distance in a row direction between the cell of the first group and each of the two cells of the third group; determining a placement of the cell of the first group,...