US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Methods of forming spacers for semiconductor devices including backside power rails" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,521, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming spacers for semiconductor devices including backside power rails" was invented by Li-Zhen Yu (New Taipei, Taiwan), Huan-Chieh Su (Tianzhong Township, Taiwan), Lin-Yu Huang (Hsinchu, Taiwan), Cheng-Chi Chuang (New Taipei, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices including air spacers formed in a backside interconnect structure and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure; a front-side ...