US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Method and system for processing wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,514, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method and system for processing wafer" was invented by Sheng-Chun Yang (Tainan, Taiwan), Chih-Lung Cheng (Miaoli County, Taiwan), Yi-Ming Lin (Tainan, Taiwan), Po-Chih Huang (Tainan, Taiwan), Yu-Hsiang Juan (Taichung, Taiwan), Xuan-Yang Zheng (Tainan, Taiwan), Ren-Jyue Wang (Hsinchu, Taiwan) and Chih-Yuan Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method and a system therefore for processing wafer. The method includes: extracting a first gas from a chamber via a first route; blocking ...