US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,541, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor package" was invented by Chi-Ming Huang (Changhua County, Taiwan), Ping-Kang Huang (Chiayi, Taiwan), Sao-Ling Chiu (Hsinchu, Taiwan) and Shang-Yun Hou (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting th...