US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 22 for "Integrated circuit device, method and system" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,586, issued on April 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit device, method and system" was invented by Wei-Ling Chang (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Hui-Zhong Zhuang (Hsinchu, Taiwan), Chia-Tien Wu (Hsinchu, Taiwan) and Jia-Hong Gao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a circuit region, a lower metal layer over the circuit region, and an upper metal layer over the lower metal layer. The lower metal layer includes a plurality of lower conductive patterns elongated along a first axis. The upper...