US Patent Issued to Taiwan Semiconductor Manufacturing on April 22 for "Extended seal ring structure on wafer-stacking" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,552, issued on April 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Extended seal ring structure on wafer-stacking" was invented by Shih-Hsorng Shen (Hsinchu, Taiwan) and Kuan-Hsien Lee (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers...