US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,151, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate" was invented by Ming-Che Lee (Tainan, Taiwan), Kuo-Ming Wu (Zhubei, Taiwan), Sheng-Chau Chen (Tainan, Taiwan), Hau-Yi Hsiao (Chiayi, Taiwan), Guanyu Luo (Chiayi County, Taiwan), Ping-Tzu Chen (Tainan, Taiwan) and Cheng-Yuan Tsai (Chu-Pei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor wafer structure including a semiconductor substrate and a plurality of semiconductor devices disposed along the ...