US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,203, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Chen-Yu Tsai (Taoyuan, Taiwan), Ku-Feng Yang (Hsinchu County, Taiwan), Tsang-Jiuh Wu (Hsinchu, Taiwan) and Wen-Chih Chiou (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a first die, a second die stacked on the first die, a smoothing layer disposed on the first die and a filling material layer disposed on the smoothing layer. The second die has a dielectric portion and a semiconductor material portion disposed on the ...