US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Semiconductor device including image sensor and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,250, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device including image sensor and method of forming the same" was invented by Min-Feng Kao (Chiayi, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Hsing-Chih Lin (Tainan, Taiwan), Feng-Chi Hung (Chu-Bei, Taiwan) and Shyh-Fann Ting (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having a front side and a back side opposite to each other. A plurality of photodetectors is disposed in the substrate within a pixel region. An isolation structure is disp...