US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,276,838, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures" was invented by Yu-Kuang Liao (Hsinchu, Taiwan), Jia-Xsing Li (Hsinchu, Taiwan), Ping-Jung Wu (Hsinchu, Taiwan), Tsang-Jiuh Wu (Hsinchu, Taiwan), Wen-Chih Chiou (Miaoli County, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupl...