ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,185, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Power distribution method" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Te-Hsin Chiu (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming an integrated circuit (IC) package includes constructing a first power distribution structure on a first die included in the IC package, thereby electrically connecting the first power distribution structure to a second power distribution structure positioned on a back side of the first die, and bonding a third power distribution struc...