US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 15 for "Method of providing a workpiece including low resistance interconnect low-resistance interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,143, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method of providing a workpiece including low resistance interconnect low-resistance interconnect" was invented by Hsin-Yen Huang (New Taipei, Taiwan), Shao-Kuan Lee (Hsinchu, Taiwan), Cheng-Chin Lee (Hsinchu, Taiwan), Hsiang-Wei Liu (Tainan, Taiwan), Tai-I Yang (Hsinchu, Taiwan), Chia-Tien Wu (Taichung, Taiwan), Hai-Ching Chen (Hsinchu, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices and methods of forming the same are provided. A method according to the present disclosure inclu...