US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,208, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer" was invented by Mao-Yen Chang (Kaohsiung, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Chun-Cheng Lin (New Taipei, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Yu-Chia Lai (Miaoli County, Taiwan) and Chih-Hsuan Tai (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor structure includes the following s...