US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 15 for "Integrated circuit structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,277,378, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit structure" was invented by Hui-Zhong Zhuang (Hsinchu, Taiwan), Ting-Wei Chiang (Hsinchu, Taiwan), Li-Chun Tien (Hsinchu, Taiwan), Shun Li Chen (Hsinchu, Taiwan) and Lee-Chung Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC structure includes a first cell and a first and second rail. The first cell includes a first and second active region and a first, a second and a third gate structure. The first active region having a first dopant type. The second active region having a second dopant type. The firs...