US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,214, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Chieh-Yen Chen (Taipei, Taiwan) and Wei Ling Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a first die array including first integrated circuit dies, orientations of the first integrated circuit dies alternating along rows and columns of the first die array; a first dielectric layer surrounding the first integrated circuit dies, surfaces of the first dielectric layer ...