US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 15 for "High bandwidth package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,166, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"High bandwidth package structure" was invented by Harry-Haklay Chuang (Hsinchu, Taiwan), Wen-Tuo Huang (Tainan, Taiwan), Wei-Cheng Wu (Hsinchu County, Taiwan), Yu-Ling Hsu (Tainan, Taiwan), Pai Chi Chou (Hsinchu, Taiwan) and Ya-Chi Hung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method according to the present disclosure includes providing a first workpiece that includes a first substrate and a first interconnect structure, providing a second workpiece that includes a second substrate, a second interconnect structure, an...