US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 15 for "Different via configurations for different via interface requirements" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,188, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Different via configurations for different via interface requirements" was invented by Shih-Che Lin (Hsinchu, Taiwan), Po-Yu Huang (Hsinchu, Taiwan), Chao-Hsun Wang (Taoyuan County, Taiwan), Kuo-Yi Chao (Hsinchu, Taiwan), Mei-Yun Wang (Hsin-Chu, Taiwan), Feng-Yu Chang (Kaohsiung, Taiwan), Rueijer Lin (Hsinchu, Taiwan), Wei-Jung Lin (Hsinchu, Taiwan) and Chen-Yuan Kao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Vias, along with methods for fabricating vias, are disclosed that exhibit reduced capacitance and resistance. An exempl...