US Patent Issued to Taiwan Semiconductor Manufacturing on April 15 for "Coplanar control for film-type thermal interface" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,162, issued on April 15, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Coplanar control for film-type thermal interface" was invented by Yu-Hsun Wang (Zhubei, Taiwan), Ping-Yin Hsieh (Hsinchu, Taiwan), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and plac...