US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 15 for "Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,199, issued on April 15, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications" was invented by Chang-Pin Huang (Taoyuan, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan), Hsien-Ming Tu (Hsinchu County, Taiwan), Ching-Jung Yang (Taoyuan, Taiwan) and Yu-Chia Lai (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method of processing a semiconductor structure. The method includes: placing a first semiconductor structure inside a semiconductor processing apparatus; s...