US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Structures and methods for high speed interconnection in photonic systems" (California, Texas Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,265,258, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structures and methods for high speed interconnection in photonic systems" was invented by Weiwei Song (San Jose, Calif.), Stefan Rusu (Sunnyvale, Calif.) and Mohammed Rabiul Islam (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal ...