US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,633, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Chih-Chien Pan (Taipei, Taiwan), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan), An-Jhih Su (Taoyuan, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed aroun...