US Patent Issued to Taiwan Semiconductor Manufacturing on April 1 for "Semiconductor packages and manufacturing methods thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,847, issued on April 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and manufacturing methods thereof" was invented by Yung-Ping Chiang (Hsinchu County, Taiwan), Chao-Wen Shih (Hsinchu County, Taiwan), Shou-Zen Chang (New Taipei, Taiwan), Albert Wan (Hsinchu, Taiwan) and Yu-Sheng Hsieh (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is ...