US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 1 for "Repackaging IC chip for fault identification" (Taiwanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,265,119, issued on April 1, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Repackaging IC chip for fault identification" was invented by Chien-Yi Chen (Hsinchu, Taiwan), Kao-Chih Liu (Changhua County, Taiwan), Chia Hong Lin (Hsinchu County, Taiwan), Yu-Ting Lin (Hsin-Chu, Taiwan) and Min-Feng Ku (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically...